Friday, February 22, 2013

Wireless Glue Networks Finds $4.5M

Lafayette, California-based Wireless Glue Networks announced Thursday that it has raised $4.5M in a Series B funding. The company, which develops software and hardware used for managing the electrical grid, said the funding came from Innovation Network Corporation of Japan, Toko Electric Corporation, Hosiden Corporation, and Clean Pacific Ventures. The firm develops software and hardware specifically being used for demand response (DR) systems in the utility industry; the firm said its products have been particularly in demand in Japan due to the issued faced by Japan due to its issues with nuclear generation following the March 2011 earthquake and tsunami. More information »